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Intellectual property and technology due diligence
Paperback
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- Book Synopsis
- Due diligence is usually a straightforward process that has not experienced radical change in recent years. In contrast, intellectual property itself is constantly evolving, highly technical, and often defines a company's position in the marketplace. Keeping up to date with changing IP laws adds to the complexities for effective due diligence. Intellectual Property and Technology Due Diligence assists the intellectual property attorney in conducting a thorough review of all aspects of intellectual property and technology, accurately assessing and analyzing the risks and benefits associated with those intangible assets, and determining how they impact transactions and the business at large. Table of Contents Chapter 1: An Introduction to Intellectual Property and Technology Due Diligence Chapter 2: The Structure of a Deal and Its Impact on the Scope of Due Diligence Chapter 3: Intellectual Property Due Diligence: An Overview Chapter 4: Trademark Due Diligence Chapter 5: Copyright Due Diligence Chapter 6: Patent Due Diligence Chapter 7: Trade Secrets Chapter 8: Technology, Data, and Online Services Due Diligence Chapter 9: Cybersecurity and Data Privacy Due Diligence Chapter 10: Due Diligence of Agreements Chapter 11: Intellectual Property Due Diligence and Government Contractors Chapter 12: The Life Sciences Sector Chapter 13: Agricultural and Plant Breeding Industry Chapter 14: Intellectual Property Acquired Through Bankruptcy Chapter 15: University-Originated Intellectual Property Chapter 16: Conforming the Provisions to Reflect the Due Diligence and the Deal Chapter 17: Security Lines Chapter 18: Closing: What Happens Next? Includes Appendices About the Editor Lacy Kolo, PhD, is a Director at the global investment bank Houlihan Lokey. As part of the Tech+IP Advisory practice at the bank, Dr. Kolo serves as an advisor for clients, providing counsel on technology and intellectual property-based transactions, mergers, and acquisitions, IP-backed capital formation, and restructuring.
- About The Author
- Lacy Kolo, JD, PhD, is a Director at the global investment bank Houlihan Lokey. As part of the Tech+IP Advisory practice at Houlihan Lokey, Dr. Kolo serves as a trusted advisor for clients, providing counsel on technology and intellectual property-based transactions, mergers and acquisitions, IP-backed capital formation, and restructuring. Dr. Kolo has spent her career working at the intersection of intellectual property, strategic transactions, and technology. In her prior role of partner at the international law firm of Squire Patton Boggs, Dr. Kolo routinely advised companies, private equity firms, and financial advisory firms on the value and impact of technology and intellectual property in complex corporate transactions. Dr. Kolo also has substantial experience on intellectual property elements of restructuring, insolvency proceedings, mergers, acquisitions, and divestitures, for both buy-side and sell-side clients. At Squire Patton Boggs, Dr. Kolo was also responsible for building and later monetizing extensive patent portfolios through enforcement efforts such as licensing and litigation. In addition, Dr. Kolo founded and successfully exited a technology company in the software development company, and a government contracting company. Dr. Kolo earned a JD from the Antonin Scalia George Mason University law school; a PhD in Pharmacological and Physiological Studies from St. Louis University; and a BA in International Studies from the University of Virginia. Dr. Kolo is a frequent speaker and author on hot topics in intellectual property, such as IP business strategies, intellectual property in transactions, and monetization. She currently serves as Chair of the Merger and Acquisition Committee for the American Intellectual Property Law Association (AIPLA).
- Product Details
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- ISBN
- 9781641051248
- Format
- Paperback
- Publisher
- American Bar Association, (21 January 2021)
- Weight
- 1021 grams
- Language
- English
- Dimensions
- 229 x 152 x 43 mm
- Categories: