Currently Out Of Stock
Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
ASME
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Paperback
€381.35
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- Book Synopsis
- Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:Autonomous, Hybrid, and Electric VehiclesEnergy Conversion and StorageFlexible and Wearable ElectronicsHeterogeneous IntegrationInternet of ThingsPhotonics and OpticsPower ElectronicsServers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions andService to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Coolingof Server Systems.
- Product Details
-
- ISBN
- 9780791859322
- Format
- Paperback
- Publisher
- ASME, (30 June 2020)
- Number of Pages
- 836
- Weight
- 1884 grams
- Language
- English
- Dimensions
- 215 x 279 x 48 mm
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