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4th International Conference on Electronics and Signal Processing
Paperback
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- Book Synopsis
- This book presents the proceedings of the 4th International Conference on Electronics and Signal Processing (ICESP 2023), which was held in Macau, China during January 13-15, 2023. The book consists of contributions from various authors from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The published papers suggest cutting-edge solutions that contribute to the quest for the future applications and communicating systems. The book is a useful reference to research students, research fellows, and scientists and engineers in the corresponding fields.
- About The Author
- Seokwon Yeom has been a faculty member of Daegu University since 2007. He is now a full professor of the same university, School of AI. He has a Ph.D. in Electrical and Computer Engineering from the University of Connecticut in 2006. His research interests are intelligent image/optical information processing, deep/machine learning, and target tracking. He has researched on multiple target tracking for the airborne early warning system, three-dimensional image processing with digital holography and integral imaging, photon-counting linear discriminant analysis and photon-counting nonlinear matched filter, millimeter wave and infrared image analysis, and long-distance target tracking for aerial surveillance and search and rescue mission with a small unmanned aerial vehicle. He has been a guest editor of Applied Sciences and Drones in MDPI. He has served as a board member of the Korean Institute of Intelligent Systems, and a member of the board of directors of the Korean Institute of Convergence Signal Processing. He was program chair of ICCCS2015, ISIS2017, iFUZZY2018, ICCCS2019, ADIP2021-2023, IPMV2024. He was a vice director of the AI homecare center and a head of the department of IT convergence engineering at Daegu University in 2020, a visiting scholar at the University of Maryland in 2014, and a director of the Gyeongbuk techno-park specialization center in 2013.
- Product Details
-
- ISBN
- 9783031366727
- Format
- Paperback
- Publisher
- Springer, (28 November 2024)
- Number of Pages
- 112
- Language
- English
- Dimensions
- 235 x 155 mm
- Series:
- See all books in this series
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