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Handbook of lead-free solder technology for microelectronic assemblies
Hardback
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- Book Synopsis
- This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
- About The Author
- Karl J. Puttlitz, Kathleen A. Stalter
- Product Details
-
- ISBN
- 9780824748708
- Format
- Hardback
- Publisher
- CRC Press, (27 February 2004)
- Number of Pages
- 1026
- Weight
- 2100 grams
- Language
- English
- Dimensions
- 254 x 261 x 64 mm
- Series:
- See all books in this series
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